The 3rd International Conference on Heterostructured Materials
July 20–23, 2026 | Hanhwa Resort Haeundae, BUSAN, Korea
Abstract Submission : Mar. 1 – June 5, 2026 / Early-Bird Registration : Apr. 1 – June 30, 2026
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Explore the rapidly emerging field of heterostructured materials (HSM), where strong property gradients and synergistic interactions open pathways to unprecedented mechanical and physical performance. This conference brings together leading experts to discuss fundamental mechanisms, scalable processing routes, and future directions that will shape the next frontier of HSM research
Irene J. Beyerlein
UC Santa Barbara (UCSB), USA
Jae-il Jang
Hanyang University, South Korea
Suveen Mathaudhu
Colorado School of Mines, USA
Dmytro Orlov
Lund University, Sweden
Matteo Seita
University of Cambridge, UK
Nobuhiro Tsuji
Kyoto University, Japan
Jian-Zhong Jiang
Fuyao University of Science and Technology, China
David Srolovitz
The University of Hong Kong, Hong Kong
